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COMPANY · ENTITY #3924

Ascend 960DT

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EVENT TIMELINE

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COMPANIES · 1 SOURCE · The Decoder

Huawei reportedly tells customers to source HBM3E for Ascend 960DT on the black market

The Information reports Huawei has told some customers to procure High-Bandwidth Memory (HBM/HBM3E) themselves amid shortages and U.S. export restrictions that limit purchases from Samsung and SK Hynix. Smugglers are allegedly bundling HBM with low-end processors routed through Hong Kong, driving black‑market prices to roughly $4,000 per HBM unit and raising memory costs per Ascend 960DT chip to as much as ~$32,000.

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COMPANIES · 1 SOURCE · TechCrunch AI

Huawei moves Ascend 960DT AI chip launch up to Q1 2027

Huawei said at its Huawei Connect conference that the next‑generation Ascend 960DT AI chip is expected to be ready in Q1 2027, earlier than a prior plan for Q3 2027, and Huawei claims Ascend 960 family chips are launching ahead of schedule with doubled performance. The company highlighted its Peerium Computing Architecture and Atlas 950 SuperPoD/SuperCluster systems, though analysts noted a discrepancy in stated SuperPoD scaling (previously 15,488 chips vs a recent reference to 4,096).

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