Huawei

2026-11-03

COMPANIES · 1 SOURCE · The Decoder

Huawei reportedly tells customers to source HBM3E for Ascend 960DT on the black market

The Information reports Huawei has told some customers to procure High-Bandwidth Memory (HBM/HBM3E) themselves amid shortages and U.S. export restrictions that limit purchases from Samsung and SK Hynix. Smugglers are allegedly bundling HBM with low-end processors routed through Hong Kong, driving black‑market prices to roughly $4,000 per HBM unit and raising memory costs per Ascend 960DT chip to as much as ~$32,000.

7.0

2026-10-06

STARTUPS · 1 SOURCE · The Decoder

Deepseek nears at least $12B funding with CATL, Tencent backing as V4-Flash drives interest

Deepseek is reported to be close to raising at least $12 billion (people say the total could approach $15 billion) in a new funding round, with battery maker CATL and Tencent taking the largest stakes. The Chinese AI startup’s V4-Flash model has been cited as the main driver of investor interest; Deepseek plans to restructure toward an IPO in early 2027, is building a data center with at least 160,000 Huawei AI chips, and is developing its own inference chip after briefly pausing the round following founder Liang Wenfeng’s viral comments about Nvidia reliance.

8.0

2026-09-30

COMPANIES · 1 SOURCE · The Decoder

Deepseek open-sources TileLang and Ascend programming tools for Huawei Ascend 950

Deepseek announced an open-source release of programming libraries and tools — centered on the TileLang language (developed at Peking University) — optimized for Huawei's Ascend chips, including work on a 128‑chip Ascend 950 supernode; Deepseek says Huawei "fully supported" the effort. The package is intended to help build a domestic software ecosystem for Chinese AI chips and presents a simpler programming model the company argues can rival Nvidia's CUDA.

7.0

2026-09-17

COMPANIES · 1 SOURCE · TechCrunch AI

Huawei moves Ascend 960DT AI chip launch up to Q1 2027

Huawei said at its Huawei Connect conference that the next‑generation Ascend 960DT AI chip is expected to be ready in Q1 2027, earlier than a prior plan for Q3 2027, and Huawei claims Ascend 960 family chips are launching ahead of schedule with doubled performance. The company highlighted its Peerium Computing Architecture and Atlas 950 SuperPoD/SuperCluster systems, though analysts noted a discrepancy in stated SuperPoD scaling (previously 15,488 chips vs a recent reference to 4,096).

7.0