U.S. government

2026-11-03

COMPANIES · 2 SOURCES · TechCrunch AI · The Verge AI

OpenAI may rebrand data centers as “AI compute campuses”

Axios reports OpenAI is preparing a post-midterms PR push and that chief global affairs officer Chris Lehane discussed several proposals, including rebranding data centers as “AI compute campuses,” advocating for U.S. involvement in global AI standards, and exploring AI “speed limits.” Lehane framed the data center debate as healthy public scrutiny; the report notes Amazon and Microsoft have faced related local-government negotiating controversies over NDAs.

5.0

2026-10-29

COMPANIES · 3 SOURCES · WIRED AI · The Verge AI · MIT Technology Review AI

Anthropic files S-1 prospectus revealing IPO plans and financials

Anthropic filed an S-1 prospectus ahead of an anticipated Nasdaq IPO under the ticker ANT, disclosing first-half 2026 results showing revenue above $16 billion (up from about $4.5 billion in 2025) and a net loss of $80.7 million; the filing lists broad business risks including compute constraints, competition, misuse of advanced AI, and a U.S. government supply-chain risk designation. The prospectus does not state target raise or valuation and emphasizes the company’s enterprise customer growth and safety-focused mission.

9.0

2026-09-30

COMPANIES · 2 SOURCES · Google · TechCrunch AI

Google named technology partner for White House's America.gov, will use Gemini

Google says it has been named a technology partner for the White House’s newly announced America.gov front door and will leverage its Gemini model to help more than 100 million people access federal services. Google frames the collaboration as supporting the administration’s digital modernization to make public services more seamless and accessible.

9.0

2026-09-16

COMPANIES · 1 SOURCE · TechCrunch AI

SK Hynix reportedly in talks with Intel to manufacture memory chips in Ohio

Reuters reports SK Hynix is discussing options with Intel to manufacture RAM/memory chips in the U.S., including leasing space at Intel’s planned Ohio fab or forming a joint venture that could involve cloud providers; SK Hynix says no decisions are finalized. The company is already building an advanced packaging facility in Indiana for HBM using DRAM wafers from Korea, and it’s unclear which memory types would be produced in Ohio if a deal proceeds.

7.0