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Intel

Related event timeline, sources and context from the news index.

EVENT TIMELINE

7

MONEY · 1 SOURCE · The Decoder

OpenAI raises about $11B of $30B fundraising target; valuation $1.25T

The Wall Street Journal reports OpenAI has raised roughly $11 billion so far in a planned $30 billion fundraising round, with the company's valuation landing at about $1.25 trillion. The company is reportedly seeking up to $20 billion from family offices and high‑net‑worth individuals and is said to be planning an IPO early next year as investor appetite cools and rivals such as Anthropic gain momentum.

8.0

MONEY · 1 SOURCE · TechCrunch AI

Intel shares plunge 28% after weak Q4 outlook, shaving $12B off US government's stake

Intel's stock fell about 28% after the company gave a weak Q4 outlook (revenue $15–16B vs. ~ $17B expected), warned gross margin would drop to ~37% from 43%, and said heavy investments mean no positive cash flow; the decline trimmed roughly $12 billion from the value of the US government's roughly 10% stake. Intel said data-center revenue rose 78% year-over-year, but capacity constraints at its fabs (one Arizona fab online, next not expected until 2028) and AI-driven memory shortages and higher PC prices are weighing on PC demand.

6.0

COMPANIES · 1 SOURCE · InfoQ AI, ML & Data Engineering

Google open-sources ML Drift GPU engine for on-device AI inference

Google released ML Drift, an Apache-2.0 open-source, cross-platform GPU compute engine for on-device AI and ML inference that abstracts multiple low-level APIs (OpenGL ES, OpenCL, Metal, WebGPU). ML Drift powers LiteRT, adds unified shaders via tensor virtualization, extensible custom ops, 5D tensor support, and hardware-specific optimizations for Arm, Intel, and Qualcomm GPUs; Google says it replaces the legacy TensorFlow Lite GPU delegate and reports lower memory overhead and app-level latency improvements in Chrome, YouTube Shorts, Photos, Adobe apps, and Snapchat.

8.0

STARTUPS · 1 SOURCE · TechCrunch AI

Tenstorrent raises $1.5B at $6.2B valuation to scale chips for open-weight AI models

Tenstorrent announced a $1.5 billion funding round led by Trace Capital and Innovation X that values the company at $6.2 billion. The startup, led by CEO Jim Keller, said it will use the capital to scale chips and Galaxy servers for serving open-weight AI models and video generation after demonstrating Galaxy running DeepSeek models; it previously received acquisition interest from Intel and Qualcomm.

7.0

COMPANIES · 4 SOURCES · WIRED AI · The Verge AI · The Decoder · TechCrunch AI

Nvidia releases OpenShell sandbox and unveils Sentry in new Open Agent Safety Platform

Nvidia has made OpenShell — its kernel-level sandbox for containing autonomous AI agents — generally available and is packaging it together with a new DPU-backed monitoring/quarantine tool called Sentry under the Open Agent Safety Platform. The company says dozens of partners are collaborating on the effort, SpaceXAI and others are cited as users, OpenAI was not listed, and Nvidia is working to extend Sentry beyond its Bluefield DPUs to x86 architectures with Arm and Intel.

8.0

COMPANIES · 3 SOURCES · Google · WIRED AI · TechCrunch AI

Google launches Googlebook laptops for Gemini; pre-orders open

Google announced Googlebook, a new category of Android-based laptops engineered to work seamlessly with Android phones and Gemini Intelligence; pre-orders are now open for flagship models from Acer, ASUS, Dell, HP and Lenovo starting at $899. Devices include on-device NPUs rated over 45 TOPS, up to 2.8K OLED touchscreens, up to 14 hours battery life, AI features like Magic Pointer, Rambler and Create My Widget, the Antigravity agent development platform, and a Level 5 security-certified pKVM hypervisor for an isolated Linux environment.

8.0

COMPANIES · 1 SOURCE · TechCrunch AI

SK Hynix reportedly in talks with Intel to manufacture memory chips in Ohio

Reuters reports SK Hynix is discussing options with Intel to manufacture RAM/memory chips in the U.S., including leasing space at Intel’s planned Ohio fab or forming a joint venture that could involve cloud providers; SK Hynix says no decisions are finalized. The company is already building an advanced packaging facility in Indiana for HBM using DRAM wafers from Korea, and it’s unclear which memory types would be produced in Ohio if a deal proceeds.

7.0